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Creators/Authors contains: "Song, Nathan"

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  1. ; ; (, 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS))
    Packaging electronic devices within electronic textiles and fibrous substrates requires an understanding of how fibers interact with circuit components in different operating conditions. In this paper, we use microeletromechanical (MEMS) devices to put devices in electrical contact with fine wires. We characterize the electronic properties of MEMS-to-wire contacts and discuss general guidelines for optimizing the design of these grippers and potential MEMS-based circuits. We then demonstrate how these grippers can act as non-rigid circuit components that effectively transfer power to devices such as LEDs. Analysis shows that our grippers are suitable conductors (under 150 Ohms) under standard operating temperatures (25-100 deg. C) with potential for use as sensors for current overflow or temperature. Methods such as parylene deposition and silver epoxy to stabilize MEMS performance are briefly discussed and explored. 
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